We will be present at the fair Empack Madrid 2016

DS Smith - Tecnicarton attend as the ninth consecutive year the fair Empack Madrid, to present their latest innovations in multimaterial packages

Next month the fair Empack Madrid will take place in Madrid, for the ninth consecutive year. This year will feature with 350 exhibitors from the packaging and logistics market, plus two conference rooms and workshops, a place where you can find in a single visit inspiration not only in packaging but also in packaging design, storage solutions and logistics for your company.

The packaging ang logistics fairs that are held, are becoming more specialized and designed to facilitate the meeting between producers and customers. That is why we will go to Empack, to show you the latest technological innovations in packaging implemented in our company and new developments as packaging.

The fair will take place during the month of November, 23 and 24 in Hall 9 of Madrid's fair, a trade show focused on showing innovative solutions for packaging, materials, solutions, design and technology.

We wait for you!