DS Smith opens game-changing Global Electronics Centre

DS Smith has now opened the innovative Global Electronics Centre (GEC) in Budapest, Hungary. This is a first for the packaging industry as it offers a central team of experts with a deep understanding of the electronics segment in one location, connected with global partners, who can manage the entire global supply cycle for global electronics customers. To do this they use new, best-in-class proprietary IT systems and processes.

DS Smith, with the GEC, demonstrates a keen understanding of the competitive global electronics industry including customers’ packaging needs, challenges and opportunities.

The combination of in-house production specialists and a database of global suppliers means that phenomenal speed to market can be achieved while ensuring that the solution developed will work in Houston, Hong Kong, and Hamburg.

“The electronics industry is crying out for something like this,” said Olivier Cottard, Head of Industries Business Units at DS Smith. “It is one of the most global industries in the world, it evolves incredibly quickly and the sensitive, high-value goods involved demand the best packaging available.”

With the GEC we can design innovative, multi-material packaging that meets standards all over the world, matches the speed-to-market of the industry itself and can be supplied anywhere it is needed with our global partners.

— Olivier Cottard, Head of Industries Business Units at DS Smith

"This facility is a one-stop shop for the electronics industry that will give them a competitive advantage through increased sales, lower costs and managed risks,” continued Cottard.

The experts in the GEC analyse and manage every aspect of the global supply cycle to guarantee exceptional packaging performance at each step from components, assembly, storage, transport right until the end consumer enjoys an unparalleled unboxing experience.

There are a few of reasons why this facility goes so much further than the customary DS Smith packaging design expertise. For a start, it is designed for global projects and all of the complexity that can entail. Secondly, the designers develop multi-material packaging so that solutions to Electrostatic discharge, excess humidity, etc. can be built into the packaging. Thirdly, the rapid development of practical prototypes demonstrates the in-depth understanding of the electronics industry. Fourth, a robust testing regime that leaves nothing to chance. Finally, in-house production capability and global suppliers mean an unbeatable roll-out schedule – a vital trait in an industry that evolves at breakneck speed.

All of this results in an optimum TCO considering a customer’s sustainability targets across all regions.

“The GEC understands the electronics industry, its challenges and opportunities, and offers globally available and localised solutions combined with the comfort and reliability of working with a centralised team of experts you can trust,” concluded Cottard.